Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a copper sintering paste. Subsequent copper sintering to the carrier pad requires a carefully controlled reducing atmosphere. Preparing for member-driven evaluations of such copper sintering systems, the APL has constructed an experimental apparatus for the sintering of copper in a formic acid environment. It will be used for studies of copper sintering kinetics and interfacial bond integrity as a function of time, temperature and pressure.

I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.