Detailed Product Description

SMT JUKI KE2060M KE2060L RL pick and place machine Laser recognition SUPPORT LED 1.2M PCB

JUKI 2060 Mounter - Technical Specifications
Patch range: 0402(1005)-SOP.PLCC.QFP.BGA,

1, substrate size M substrate (330 × 250mm)

For the L substrate (410 x 360mm).

Lwide (510 x 360mm).

For E substrate (510×460mm)

2, component size 0603 chip (inch 0201) chip ~ 20mm square element or 26.5 × 11mm (0402 (imperial 01005)

3, component placement speed chip components 13,200CPH *1

4, component placement accuracy laser recognition ± 0.05mm

5, component placement type up to 80 kinds (converted into 8mm band

6, device size * 2 (W × D × H * 3) 1,400 × 1,393 × 1,440 mm

7, weight: about 1,400kg

12,500CPH: chip (laser recognition / actual production ergonomics)

■ 1,850CPH: IC (image recognition/actual production ergonomics), 3,400CPH: IC (image recognition/using MNVC)

■ Laser head × 1 (4 nozzles) & high resolution visual head × 1 (1 nozzle)

■ 0603 (Inch 0201) chip ~ 74mm square element, or 50 × 150mm0402 (Inch 01005) chip factory options

■ Image recognition (reflection/transmission recognition, ball recognition, segmentation recognition)

※ There are differences in the placement speed conditions.

Board size

For M substrate (330×250mm)

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For L substrate (410×360mm)

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Lwide (510×360mm)

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For E substrate (510×460mm)*1

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Component size

Laser recognition

0603 chip (imperial 0201) chip ~ 33.5mm square element

Image Identification

1.0×0.5mm*2～74mm square element

Or 50×150mm

(0402 (inch 01005) chip requires options) *9

Component placement speed

Chip components

12,500CPH*3

IC components

1,850CPH*3*4

3,400CPH*5

Component placement accuracy

Laser recognition

±0.05mm

Image Identification

±0.03mm (±0.04mm when using MNVC (option))

Up to 80 kinds of component placement (converted to 8mm tape)*6

Device size*7(W×D×H*8)1,400×1,393×1,440mm

Weight about 1,410kg

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