JUKI KE2080 Pick and Place Machine

Products description

Chip：
20,200CPH（laser centering/Optimum）（0.178Sec./chip)
16,700CPH（laser centering/IPC9850）

IC：
1,850CPH (vision centering / effective tact)
4,860CPH with MNVC option.
(510 x 360 mm) L-Wide substrate (510 x 360 mm) (optional) E Substrate (510 x 460 mm) *1
Component size: Laser recognition 0402 (English 01005) Chip ~ 33.5mm square element

Image recognition standard Camera: 3mm square element * 2 ~ 74mm square or 50 × 150mm
high resolution camera (optional): 1.0 × 0.5mm * 3 ~ 48mm square element or 24 × 72mm
Component Mounting speed: Chip components Best conditions: 0.178 seconds / chip
(20,200CPH) IPC9850 16,700CPH IC components * 3 1,850CPH 4,860CPH * 4

Component Mounting accuracy: Laser recognition: ± 0.05mm (Cpk ≧ 1)

Image recognition: ± 0.03mm (± 0.04mm when using MNVC (optional)

Component Mounting Type: Up to 80 (converted to 8mm) * 5
One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)

<p font-size:14px;background-color:#ffffff;"="" style="box-sizing: border-box; margin-top: 0px; margin-bottom: 10px; font-family: opensans, Arial, Helvetica, sans-serif; font-size: 14px; white-space: normal; background-color: rgb(255, 255, 255); color: rgb(34, 34, 34);">From 0402 (01005) to 74mm square components or 50×150mm
Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)

1）Please ask for details on E size board.
2）When using MNVC. (option)
3）When using high-resolution camera. (option)

4）Effective tact: The IC placement speed indicates an estimated value obtained when the machine

places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.

(CPH=number of components placed for one hour)
5）Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
6）Including matrix tray changer, max 110.

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