According to the mounting speed of components, it can usually be divided into the following types.
1. Low and medium speed placement machine
The theoretical placement speed of medium and low speed placement machines is below 30,000 pieces / h (chip components).
Medium and low-speed placement machines are generally referred to as medium-speed placement machines, also known as mid-range placement machines. Most of the medium-speed placement machines adopt an arch structure. The structure is relatively simple, the placement accuracy is poor, the area is small, and the environmental requirements are low.
2. High-speed placement machine
The theoretical placement speed of the high-speed placement machine is 30,000 to 60,000 pieces / h.
High-speed placement machines are mainly used to mount small chip components and small integrated components, and some high-speed machines also have the function of mounting small ball-shaped matrix components (BGA). The structure of the high-speed placement machine is more commonly used in the turret structure, and the composite structure is also more commonly used. High-speed placement machines are widely used in large electronic manufacturing enterprises and some professional original equipment manufacturing enterprises (OEMs).
Like the medium-speed placement machine, with the development of science and technology, the speed of the high-speed placement machine is getting faster and faster. The speed of the high-speed placement machine has also been increased from 14000 pieces / h to nearly 60,000 pieces / h. The design of the placement machine has also developed from the main consideration of speed to the consideration of high placement accuracy, high reliability, multi-function, easy operation and maintenance, and the ability to quickly replace products.
3. Super high-speed placement machine
The theoretical placement speed of the ultra-high-speed placement machine is higher than 60,000 pieces / h.
Ultra-high-speed placement machines are also higher-speed placement machines developed on the basis of high-speed placement machines. In addition to mounting small chip components and small integrated components, some of these placement machines can also mount ball matrices. Components (BGA). In addition, some ultra-high-speed placement machines are equipped with high-precision multi-function placement heads, which become a high-speed multi-function placement machine that can mount small components at high speed as well as large high-precision and special-shaped components.